DMG/ DLG Series
END-STACKABLE TYPE
Features
- End stackable for standard 0.1 integrated circuit pitch
- Molded 0.3 integrated circuit packing outline allowing automatic insertion
- Smaller size makes better heat convection during PC board reflow soldering
- Top tape sealed to withstand reflow soldering, board washing
- All plastics are UL 94V-0 grade fire retardant
- Twin contacts designed to ensure stable contact
- Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent contamination during soldering
- RoHS Compliant
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Technical Product Information
